Nippon Chemi-Con Module Structure Evaluation Technology
When evaluating module creation, design is conducted by taking into account factors such as voltage and current balance, vibration resistance, and heat countermeasures.
As the performance of electronic devices improves, the number of electronic components used in a device increases, resulting in increasingly complicated board layout.
Product development requires the implementation of various measures. For example, connecting devices with low voltage resistance in a series, like with supercapacitors, requires ensuring voltage balance between the two elements.
We use our knowledge as an electronic components manufacturer to evaluate optimal structures for parts and make proposals to customers.
[Evaluation workflow (example)]
- Specifications (requirements for size, vibration resistance, etc.) provided by customer
- Use 3D CAD to evaluate structure
- Link to CAE analysis(Assess component heat distribution and subsequent impact on product lifetime)
Structure evaluation example
If you have any questions or inquiries that do not apply to the above, please contact us at the following address.