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Aluminum Electrolytic Capacitors for Through Hole Reflow ECST250E222M20X1MA

  • RoHS2
  • For Through Hole Reflow
  • For All Reflow
  • Machine Inserting

ECST250E222M20X1MA

Possible completed reflow procedure due to adopting Aluminum Electrolytic Capacitor of lead type which is possible to make reflow.
Eliminating flow steps reduces the work involved in process and facility management, contributing to total cost improvements.
Improves terminal position accuracy to enable automated mounting. Possible to tuning in a high sound quality.

Part Number ECST250E222M20X1MA
Status In Production
Polarity Polar
Category Temperature Range -40℃～105℃
Rated Voltage 25 Vdc
Capacitance 2200 µF
Capacitance Tolerance -20～20%(M) / 20℃, 120Hz
Dimensions ⌀ D 12.5mm
Dimensions L 23mm max
Rated Ripple Current 2000mArms / 105℃ / 100kHz
Leakage Current 1650 μA max / 20℃, after 1 minute
Dissipation Factor (tanδ) 0.16 max / 20℃, 120Hz
Endurance Temperature / Time / Overload 105℃ / 3000hrs / DC+Ripple
Vibration Resistance 10 to 200 to 10Hz in about 1minute, 98m/s2 (10G), 2hours in each for X and Y and Z axis
Reference Weight
?
This is a representing value calculated from a standard material composition.
Note that the reference weights are not considered as guaranteed value.
 4.6g
Minimum Order Quantity 300pcs
RoHS Compliant
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10 Restricted Substances
2011/65/EU and (EU) 2015/863
 Compliant

Rated Ripple Current Multipliers

拡大表示する

Frequency Multipliers
Frequency [Hz]1201k10k100k
Multipliers0.600.870.951.00

Dimension [mm]

Dimension [mm]

Recommended soldering conditons

  • Peak Temperature
    240℃
    Time maintained above 230℃
    20sec
    Preheat
    150～180℃, 120sec
    Reflow number
    2 times or less

Notes on Reflow soldering

Reflow the capacitors within recommended reflow soldering conditions.
Verify there is no temperature stress to the capacitors because the following differences might degrade capacitors electrically and mechanically.
Please consult us if other reflow conditions are employed.
1. Location of components : Temperature increases at the edge of PC board more than the center.
2. Population of PC board : The lower the component population is, the more temperature rises.
3. Material of PC board : A ceramic made board needs more heat than a glass epoxy made board. The heat increase may cause damage to the capacitors.
4. Thickness of PC board : A thicker board needs more heat than a thinner board. The heat increase may damage the capacitors.
5. Size of PC board : A larger board needs more heat than a smaller board. The heat increase may damage the capacitors.
6. Solder thickness : If very thin cream solder paste is to be used for SMD types, please consult with us.
7. Location of infrared ray lamps : IR reflow as well as hot plate reflow heats only on the reverse side of the PC board to lessen heat stress to the capacitors.
8. Please consult us about vapor phase soldering (VPS).