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Overview of Silicon Wafers

Silicon wafers are the substrate material used in semiconductors. They are the substrate of various components that fall under the label of semiconductors. These include CPUs, memory, and transistors. Such components are present in nearly all the electronic devices we use today.

A silicon wafer is an approximately 1 mm thick slice of high-purity crystallized silicon ingot. Its surface is polished to remove as many irregularities and minute particles (dust, dirt) as possible. A film is then deposited on the surface of this silicon wafer to create a pattern. Then the wafer is cut (dicing) to complete the chip portion of a semiconductor. Once these chips have been wired up and packaged, the semiconductor component is complete.

In recent years, as devices have added ever-more functionality, these patterns have become increasingly delicate, requiring high-precision at every step in the process. In addition, silicon wafers have grown in size to boost production efficiency, and increasingly advanced demands are being made of them. In order to respond to these market conditions, Nippon Chemi-Con provides dummy wafer and wafer reclamation processing services. These services support evaluation of devices and prototypes that are pushing the boundaries of silicon wafers. We also support customers by providing the primary components that serve as secondary materials in semiconductor production.

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